YC-FSLC500

Medical stent ultra-fast femtosecond laser cutting machine (five-axis & infrared & green light)

Application scope : Application scope Laser microprocessing of metal & non-metal stents such as intracranial & thrombectomy & neurointerventional & peripheral & lithotomy baskets Technical certification . CE . ISO9001 . ISO13485

Whatsapp：8613775288830‬

E-mail：info@yuncogroup.com

Detail

High precision machining
. Small cutting slit width: <20um
. High processing accuracy: ≤±5um
. Good cutting quality: infrared & green light processing modes are available, no burrs & smooth cutting & minimal heat affected zone
. High processing efficiency: cutting through one side of the pipe wall at one time, continuous automatic feeding and processing

Strong adaptability
. Capable of laser dry cutting & wet cutting & drilling & blind groove digging and other fine processing technology capabilities
. Supports the processing of centripetal, vertical and composite opening features of equal-diameter tubes, reducing tubes and planar instruments.
. Can process 316L&Ni-Ti&L605&Fe&Mg&Zn&PLA&PLLA& &PI&nylon&glass and other metal & non-metal materials
. Compatible with precision thin-walled tube clamping systems such as precision D-type chucks & ER series chucks & three-jaw chucks
.Using a combined precision thin-walled tube bushing support system that adapts to shape tolerance changes
. Provide supporting solutions such as continuous automatic feeding processing of precision thin-walled tubes & wet and dry cutting, sealing and splicing.
. Equipped with self-developed laser micromachining 2D & 2.5D & 3D CAM software system

Flexible design
. Follow the ergonomic design concept, exquisite and simple
. Configure a machine vision system to monitor the laser dynamic processing process online in real time.
. Closed optical path system & precision laser cutting head design, stable and reliable
. Flexible combination of software & hardware functions, supporting personalized function configuration & intelligent production management
.Support forward innovative design from component level to system level
. Open control & laser micromachining software system is easy to operate & intuitive interface

Technical Parameters

Maximum operating speed	500mm/s (X); 100mm/s (Y); 100mm/s (Z); 600rpm (θ);
Positioning accuracy	±1um(X);±3um(Y);±3um(Z);&# 177;15arcsec(θ);
Repeat positioning accuracy	±0.2um(X);±1um(Y);±1um(Z);& #177;3arcsec(θ);
Cutting seam width	15um~25um;
Rebar width consistency	<±5um;
Processing material	316L&Ni-Ti&L605&Fe&Mg&Zn&PLA&PLLA& &PI&nylon&glass and other metal & non-metal materials;
Pipe blank length	<2.5m (longer lengths can be customized);
Processing wall thickness	0~0.5±0.02 mm;
Clamping pipe diameter	Φ0.1~Φ7.5±0.02 mm&Φ0.3 ~Φ16.0&# 177;0.02 mm&Φ1.0 ~Φ30.0±0.02;
Single processing range	0～500mm (longer products will be processed by segmented splicing);
Laser type	Infrared & green femtosecond laser;
Laser wavelength	1030nm~1070nm±10nm&532nm±10nm;
Laser power	10W&16W&20W for selection;
Power supply	220V±10%; 50Hz; AC 25A (main circuit breaker);
Compatible file formats	DXF, DWG;
Device dimensions	2100mmx1350mmx1750mm;
Device weight	1800Kg;