YC-ESM8

Endoscopic cobra bone laser processing center (four-axis)

Application scope : Application Scope Medical endoscopes, industrial endoscopes, electronic endoscopes, snake bone laser microprocessing Technical Certification . CE . ISO9001 . ISO13485

Whatsapp：8613775288830‬

E-mail：info@yuncogroup.com

Detail

Endoscopic cobra bone laser processing center (four-axis)插图

High precision machining
. Small cutting slit width: 15~30um
. High processing precision: ≤±10um
. Good incision quality: no burrs & smooth incision
. High processing efficiency: cutting through one side of the pipe wall at one time, continuous automatic feeding and processing

Strong adaptability
. Capable of laser dry cutting & wet cutting & drilling & grooving and other fine processing techniques
. Supports the processing of centripetal, vertical and composite opening features of equal-diameter tubes, reducing tubes and planar instruments
. Can process 304&316L&Ni-Ti&L605 and other alloy materials
. Compatible with precision thin-walled tube clamping systems such as precision D-type chucks & ER series chucks & three-jaw chucks
. Combined precision thin-walled tube bushing support system using adaptive shape tolerance changes
. Provide supporting solutions such as continuous automatic feeding processing of precision thin-walled tubes & wet and dry cutting, sealing and splicing
. Equipped with self-developed laser micromachining 2D & 2.5D & 3D CAM software system

Flexible design
. Follow the ergonomic design concept, exquisite and simple
. Provides optional function for machine vision system to monitor dynamic laser processing process online in real time
. Flexible combination of software & hardware functions, supporting personalized function configuration & intelligent production management
.Support forward innovative design from component level to system level
. Open control & laser micromachining software system is easy to operate & intuitive interface

Technical parameters

Maximum operating speed	300mm/s (X); 50mm/s (Y); 50mm/s (Z); 600rpm (θ);
Positioning accuracy	±3um（X）；±3um（Y）；±3um（Z）;&# 177;15arcsec(θ);
Repeat positioning accuracy	±1um(X);±1um(Y);±1um(Z);&# 177;3arcsec(θ);
Cutting seam width	15um~30um;
Processing material	304, 316L, Ni-Ti, L605 and other alloys;
Pipe blank length	<2.5m (support fixture can be customized);
Processing wall thickness	0~1.0±0.02 mm;
Pipe processing range	Φ0.3~Φ7.5&Φ1.0~Φ16.0±0.02 mm;
Planar processing range	200mm*100mm;
Processing range	0～300mm (longer products will be processed by segmented splicing);
Remaining material length	60mm;
Laser type	Fiber laser
Laser wavelength	1030~1070±10nm;
Laser power	100W&200W&250W&300W&500W for selection;
Power supply	220V±10%, 50Hz; AC 20A (main circuit breaker);
Compatible file formats	DXF, DWG;
Device dimensions	1600mmx950mmx1700mm;
Device weight	1500Kg;