YC-MPLC6045

Medical flat instrument laser cutting machine

Application scope : Application Scope Laser microprocessing of flat and curved medical devices such as cranial fixation pieces & connecting pieces & electrode pieces Technical Certification . CE . ISO9001 . ISO13485

Whatsapp：8613775288830‬

E-mail：info@yuncogroup.com

Detail

Medical flat instrument laser cutting machine插图

High precision machining
. Small cutting slit width: 15~30um
. High processing precision: ≤±10um
. Good incision quality: no burrs & smooth incision
. High processing efficiency: direct-drive mobile dual-drive system, cutting through a single layer of material at one time

Strong adaptability
. Possessing the capabilities of laser cutting, drilling, grooving, scribing and other fine processing techniques
. Can process 304&316L&Ni-Ti&L605&Li&Mg&Al&Cu&Fe&Ceramic and other materials
. Can process flat and curved surfaces
. Provide optional functions such as dual work stations & machine vision positioning* splicing and closed blanking & automatic loading and unloading system* dynamic monitoring of processing
. Equipped with self-developed long and short focal length fine laser cutting heads with pointed and flat nozzles & compatible with commercially available laser cutting heads
. Equipped with self-developed laser micromachining 2D & 2.5D & 3D CAM software system

Flexible design
. Follow the ergonomic design concept, exquisite and simple
. Flexible combination of software & hardware functions, supporting personalized function configuration & intelligent production management
.Support forward innovative design from component level to system level
. Open control & laser micromachining software system is easy to operate & intuitive interface

Technical parameters

Maximum running speed	500mm/s (X); 500mm/s (Y1&Y2); 50mm/s (Z);
Positioning accuracy	±3um(X)±3um(Y1&Y2);±5um(Z);
Repeat positioning accuracy	±1um(X);±1um(Y1&Y2);±3um(Z);
Processing material	304&316L&Ni-Ti&L605&Li&Mg&Al&Cu&Fe&Ceramic and other materials;
Material wall thickness	0~2.0±0.02 mm;
Plane processing range	450mm*600mm;
Laser type	Fiber laser;
Laser wavelength	1030~1070±10nm;
Laser power	100W&200W&250W&300W&500W&1000W&QCW150W for selection;
Power supply	220V±10%, 50Hz; AC 25A (main circuit breaker);
Compatible file formats	DXF&DWG;
Device dimensions	1280mm1320mm1600mm;
Device weight	1500Kg;